MediaTek has revealed an addition to its line of premium 5G chipsets designed to help the company compete on level footing at the upper end of the nutikas telefon turul.
The new Dimensity 9000+ SoC slots in at the top of the MediaTek portfolio, bundling eight CPU cores based on Arm’s v9 architecture with an Arm Mali-G710 GPU.
As with the previous model, the chipset also boasts 8MB L3 cache, 6MB system cache, a high-performance modem, Wi-Fi 6E and Bluetooth 5.3 support and an integrated APU for AI acceleration.
Although the specs are largely identical to the base Dimensity 9000, the new SoC is said to offer a material performance boost across graphical and traditional workloads, thanks to the ability to run cores at higher clock speeds.
Historically, MediaTek has played in the somewhat less sexy portions of the mobile chipset market, featuring inside budget and mid-range phones aimed at users for whom performance isn’t necessarily the priority.
Dimensity 9000 turule toomine eelmise aasta detsembris andis märku a shift strateegias, mille käigus MediaTek proovib esimest korda jõuda välklaevade mobiilseadmetesse – valdkonda, kus traditsiooniliselt domineerib Qualcomm.
At MWC 2022, TechRadar Pro rääkis MediaTeki müügi eest vastutavate juhtide Pascal Lemassoni ja Rob Moffatiga, kes andsid lisakonteksti ettevõtte uuele lähenemisviisile ja uute Dimensity kiipide olulisusele.
„Strateegia on pakkuda oma klientidele kiibikomplekte alt üles. Enne Dimensity 9000 oli meil ülaosas vahe,” ütles Moffat. "Viimase kolme aasta jooksul on meie investeeringud teadus- ja arendustegevusse olnud tohutud ja 5G on meie jaoks tohutu võimalus, mistõttu oleme võtnud vastu otsuse sihtida tipptasemel turgu."
"Lõppkokkuvõttes peame keskenduma tehnoloogia juhtpositsioonile, mis viib teid automaatselt tipptasemel toodete hulka."
The arrival of the Dimensity 9000+, meanwhile, adds another string to the MediaTek bow, perhaps giving OEMs a difficult choice to make when selecting a configuration for their upcoming flagships.
“Building on the success of our first flagship 5G chipset, the Dimensity 9000+ ensures that device makers always have access to the most advanced high-performance features and the latest mobile technologies, making it possible for their top-tier smartphones to stand out,” said Dr. Yenchi Lee, Deputy GM of Wireless Communications at MediaTek.
“With a suite of top-tier AI, gaming, multimedia, imaging and connectivity features, the Dimensity 9000+ delivers faster gameplay, seamless streaming and an all-around better user experience.”
Smartphones based on the MediaTek Dimensity 9000+ are set to go to market in the third quarter.