MediaTek has revealed an addition to its line of premium 5G chipsets designed to help the company compete on level footing at the upper end of the smartphone kev ua lag luam.
The new Dimensity 9000+ SoC slots in at the top of the MediaTek portfolio, bundling eight CPU cores based on Arm’s v9 architecture with an Arm Mali-G710 GPU.
As with the previous model, the chipset also boasts 8MB L3 cache, 6MB system cache, a high-performance modem, Wi-Fi 6E and Bluetooth 5.3 support and an integrated APU for AI acceleration.
Although the specs are largely identical to the base Dimensity 9000, the new SoC is said to offer a material performance boost across graphical and traditional workloads, thanks to the ability to run cores at higher clock speeds.
Historically, MediaTek has played in the somewhat less sexy portions of the mobile chipset market, featuring inside budget and mid-range phones aimed at users for whom performance isn’t necessarily the priority.
Lub community launch ntawm Dimensity 9000 nyob rau lub Kaum Ob Hlis xyoo tas los tau taw qhia ib shift nyob rau hauv lub tswv yim, uas yuav pom MediaTek sim thawj zaug rau cov leeg nws txoj hauv kev mus rau hauv flashship mobile pab kiag li lawm, ib thaj tsam ib txwm dominated los ntawm Qualcomm.
At MWC 2022, TechRadar Pro tau hais rau Pascal Lemasson thiab Rob Moffat, cov thawj coj saib xyuas kev muag khoom ntawm MediaTek, uas tau muab cov ntsiab lus ntxiv nyob ib ncig ntawm lub tuam txhab txoj hauv kev tshiab thiab qhov tseem ceeb ntawm nws cov chips tshiab Dimensity.
"Lub tswv yim yog muab peb cov neeg siv khoom chipsets hauv qab mus rau sab saum toj. Ua ntej Dimensity 9000, peb muaj qhov sib txawv ntawm qhov kawg, "Moffat hais. "Nyob rau hauv peb lub xyoos dhau los, peb cov peev R & D tau loj heev thiab 5G yog lub sijhawm zoo rau peb, yog li peb tau txiav txim siab los tsom mus rau lub lag luam high-end."
"Thaum kawg, peb yuav tsum tau tsom mus rau kev coj noj coj ua thev naus laus zis, uas coj koj mus rau hauv cov khoom lag luam saum toj kawg nkaus."
The arrival of the Dimensity 9000+, meanwhile, adds another string to the MediaTek bow, perhaps giving OEMs a difficult choice to make when selecting a configuration for their upcoming flagships.
“Building on the success of our first flagship 5G chipset, the Dimensity 9000+ ensures that device makers always have access to the most advanced high-performance features and the latest mobile technologies, making it possible for their top-tier smartphones to stand out,” said Dr. Yenchi Lee, Deputy GM of Wireless Communications at MediaTek.
“With a suite of top-tier AI, gaming, multimedia, imaging and connectivity features, the Dimensity 9000+ delivers faster gameplay, seamless streaming and an all-around better user experience.”
Smartphones based on the MediaTek Dimensity 9000+ are set to go to market in the third quarter.