MediaTek has revealed an addition to its line of premium 5G chipsets designed to help the company compete on level footing at the upper end of the smartphone trhu.
The new Dimensity 9000+ SoC slots in at the top of the MediaTek portfolio, bundling eight CPU cores based on Arm’s v9 architecture with an Arm Mali-G710 GPU.
As with the previous model, the chipset also boasts 8MB L3 cache, 6MB system cache, a high-performance modem, Wi-Fi 6E and Bluetooth 5.3 support and an integrated APU for AI acceleration.
Although the specs are largely identical to the base Dimensity 9000, the new SoC is said to offer a material performance boost across graphical and traditional workloads, thanks to the ability to run cores at higher clock speeds.
Historically, MediaTek has played in the somewhat less sexy portions of the mobile chipset market, featuring inside budget and mid-range phones aimed at users for whom performance isn’t necessarily the priority.
Uvedenie modelu Dimensity 9000 na trh v decembri minulého roka signalizovalo a shift v stratégii, vďaka ktorej sa MediaTek po prvý raz pokúsi presadiť sa do flashových mobilných zariadení, v oblasti tradične ovládanej spoločnosťou Qualcomm.
Na MWC 2022 TechRadar Pro hovorili s Pascalom Lemassonom a Robom Moffatom, vedúcimi pracovníkmi zodpovednými za predaj spoločnosti MediaTek, ktorí poskytli ďalší kontext týkajúci sa nového prístupu spoločnosti a významu jej nových čipov Dimensity.
„Stratégiou je ponúknuť našim zákazníkom čipové sady zdola nahor. Pred Dimensity 9000 sme mali medzeru na hornom konci,“ povedal Moffat. „Za posledné tri roky boli naše investície do výskumu a vývoja obrovské a 5G je pre nás obrovskou príležitosťou, preto sme sa rozhodli zacieliť na trh vyššej kategórie.“
„V konečnom dôsledku sa musíme zamerať na vedúce postavenie v oblasti technológií, ktoré vás automaticky privedie k produktom najvyššej úrovne.“
The arrival of the Dimensity 9000+, meanwhile, adds another string to the MediaTek bow, perhaps giving OEMs a difficult choice to make when selecting a configuration for their upcoming flagships.
“Building on the success of our first flagship 5G chipset, the Dimensity 9000+ ensures that device makers always have access to the most advanced high-performance features and the latest mobile technologies, making it possible for their top-tier smartphones to stand out,” said Dr. Yenchi Lee, Deputy GM of Wireless Communications at MediaTek.
“With a suite of top-tier AI, gaming, multimedia, imaging and connectivity features, the Dimensity 9000+ delivers faster gameplay, seamless streaming and an all-around better user experience.”
Smartphones based on the MediaTek Dimensity 9000+ are set to go to market in the third quarter.
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