MediaTek has revealed an addition to its line of premium 5G chipsets designed to help the company compete on level footing at the upper end of the 智能手机 市场。
The new Dimensity 9000+ SoC slots in at the top of the MediaTek portfolio, bundling eight CPU cores based on Arm’s v9 architecture with an Arm Mali-G710 GPU.
As with the previous model, the chipset also boasts 8MB L3 cache, 6MB system cache, a high-performance modem, Wi-Fi 6E and Bluetooth 5.3 support and an integrated APU for AI acceleration.
Although the specs are largely identical to the base Dimensity 9000, the new SoC is said to offer a material performance boost across graphical and traditional workloads, thanks to the ability to run cores at higher clock speeds.
Historically, MediaTek has played in the somewhat less sexy portions of the mobile chipset market, featuring inside budget and mid-range phones aimed at users for whom performance isn’t necessarily the priority.
去年 9000 月推出的天玑 XNUMX 标志着 shift 在战略方面,联发科将首次尝试进军闪存移动设备领域,这一领域传统上由高通公司主导。
At MWC 2022, 科技雷达专业版 与联发科负责销售的高管 Pascal Lemasson 和 Rob Moffat 进行了交谈,他们就公司的新方法及其新 Dimensity 芯片的重要性提供了更多背景信息。
“我们的策略是为我们的客户提供自下而上的芯片组。 在天玑 9000 之前,我们在高端有一个差距,”莫法特说。 “过去三年,我们的研发投入很大,5G对我们来说是一个巨大的机会,所以我们决定瞄准高端市场。”
“最终,我们需要专注于技术领先地位,这会让你自动进入顶级产品。”
The arrival of the Dimensity 9000+, meanwhile, adds another string to the MediaTek bow, perhaps giving OEMs a difficult choice to make when selecting a configuration for their upcoming flagships.
“Building on the success of our first flagship 5G chipset, the Dimensity 9000+ ensures that device makers always have access to the most advanced high-performance features and the latest mobile technologies, making it possible for their top-tier smartphones to stand out,” said Dr. Yenchi Lee, Deputy GM of Wireless Communications at MediaTek.
“With a suite of top-tier AI, gaming, multimedia, imaging and connectivity features, the Dimensity 9000+ delivers faster gameplay, seamless streaming and an all-around better user experience.”
Smartphones based on the MediaTek Dimensity 9000+ are set to go to market in the third quarter.