MediaTek has revealed an addition to its line of premium 5G chipsets designed to help the company compete on level footing at the upper end of the smartphone marché.
The new Dimensity 9000+ SoC slots in at the top of the MediaTek portfolio, bundling eight CPU cores based on Arm’s v9 architecture with an Arm Mali-G710 GPU.
As with the previous model, the chipset also boasts 8MB L3 cache, 6MB system cache, a high-performance modem, Wi-Fi 6E and Bluetooth 5.3 support and an integrated APU for AI acceleration.
Although the specs are largely identical to the base Dimensity 9000, the new SoC is said to offer a material performance boost across graphical and traditional workloads, thanks to the ability to run cores at higher clock speeds.
Historically, MediaTek has played in the somewhat less sexy portions of the mobile chipset market, featuring inside budget and mid-range phones aimed at users for whom performance isn’t necessarily the priority.
Le lancement du Dimensity 9000 en décembre dernier a marqué une shift en stratégie, qui verra MediaTek tenter pour la première fois de se frayer un chemin dans les appareils mobiles flashship, un domaine traditionnellement dominé par Qualcomm.
Au MWC 2022, Tech Radar Pro s'est entretenu avec Pascal Lemasson et Rob Moffat, responsables des ventes chez MediaTek, qui ont fourni un contexte supplémentaire autour de la nouvelle approche de l'entreprise et de l'importance de ses nouvelles puces Dimensity.
« La stratégie consiste à proposer à nos clients des chipsets de bas en haut. Avant le Dimensity 9000, nous avions un écart au sommet », a déclaré Moffat. "Au cours des trois dernières années, nos investissements en R&D ont été massifs et la 5G est une énorme opportunité pour nous, nous avons donc pris la décision de cibler le marché haut de gamme."
"En fin de compte, nous devons nous concentrer sur le leadership technologique, qui vous emmène automatiquement vers des produits de premier plan."
The arrival of the Dimensity 9000+, meanwhile, adds another string to the MediaTek bow, perhaps giving OEMs a difficult choice to make when selecting a configuration for their upcoming flagships.
“Building on the success of our first flagship 5G chipset, the Dimensity 9000+ ensures that device makers always have access to the most advanced high-performance features and the latest mobile technologies, making it possible for their top-tier smartphones to stand out,” said Dr. Yenchi Lee, Deputy GM of Wireless Communications at MediaTek.
“With a suite of top-tier AI, gaming, multimedia, imaging and connectivity features, the Dimensity 9000+ delivers faster gameplay, seamless streaming and an all-around better user experience.”
Smartphones based on the MediaTek Dimensity 9000+ are set to go to market in the third quarter.